[会议信息][2008.10][北京]International Conference on Solid-State and Integrated-Circuit Technology

The 2008 ICSICT conference is the ninth of its kind aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held during October 20-23, 2008 in Beijing , China . UCF[oO>v  
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All aspects of solid-state devices, circuits, processing technologies, materials and other related research are within the scope of the conference. The three days of contributed and invited presentations on the latest developments in diverse fields given in oral and poster sessions, panel discussions on leading edge technology issues, and other activities will provide extensive opportunities for technical information exchange as well as a stimulating environment for mutual communication among participants. There will be discussions devoted to opportunities for cooperation and joint ventures in the microelectronics business in China . Best Paper Award will be issued at the closing of the conference. bX{PSjD  
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The Scope and Topics of the Conference m){&:Hs  
(Papers are solicited in, but not limited to the following areas) YPQCOG  
1.Silicon/Germanium/III-V IC devices ^K>pT}u  
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2.Advanced process technology o}R|tOe  
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3.Silicon integrated circuits manufacturing fiqj;GW  
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4.Advanced memory technologies $y4M#yv  
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5.Compound semiconductor devices and circuits b
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6.Device and interconnect reliability %#Q #N,fw  
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7.Modeling and simulation 9oD#t~+F4  
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8.Semiconductor materials and material characterization #ZwY?T x  
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9.Quantum electronics and nano-electronics 2^ kn5  
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10.Photonic devices and technologies Sl~C0eO  
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11.Sensors and MEMS ZArf;&8  
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12.ASICs and SOC design technologies Oi#k:vq4  
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13.Low power circuits Ko}7$2
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14.Digital, analog and mixed-signal circuits 2c*2\93>  
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15.RF and microwave circuits 7x:F!0:  
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15.EDA and DFM technologies v_.j/2U  
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16.Testing and DFT technologies C$0ITw  
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17.Organic semiconductor devices and technologies y7 <(,uT  
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18.Packaging and assembly technologies LQ|<3]  
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