[会议信息][2008.10][北京]International Conference on Solid-State and Integrated-Circuit Technology

The 2008 ICSICT conference is the ninth of its kind aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held during October 20-23, 2008 in Beijing , China . Rv)>xw  
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All aspects of solid-state devices, circuits, processing technologies, materials and other related research are within the scope of the conference. The three days of contributed and invited presentations on the latest developments in diverse fields given in oral and poster sessions, panel discussions on leading edge technology issues, and other activities will provide extensive opportunities for technical information exchange as well as a stimulating environment for mutual communication among participants. There will be discussions devoted to opportunities for cooperation and joint ventures in the microelectronics business in China . Best Paper Award will be issued at the closing of the conference. ^(~%'f  
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The Scope and Topics of the Conference UzT"Rb:e  
(Papers are solicited in, but not limited to the following areas) 6 B*,Mu4A  
1.Silicon/Germanium/III-V IC devices 67A g.f6-  
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2.Advanced process technology o((!3H{D  
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3.Silicon integrated circuits manufacturing z65Q"A  
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4.Advanced memory technologies \&b1%Asyz  
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5.Compound semiconductor devices and circuits vY!'@W  
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6.Device and interconnect reliability 1s6L]&B  
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7.Modeling and simulation PAS0 D #  
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8.Semiconductor materials and material characterization kn&>4/')  
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9.Quantum electronics and nano-electronics nj
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10.Photonic devices and technologies -d_7 q  
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11.Sensors and MEMS tFu"h1  
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12.ASICs and SOC design technologies IM=3n%6  
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13.Low power circuits x@? Y
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14.Digital, analog and mixed-signal circuits >8.o  
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15.RF and microwave circuits DE!c+s_g4  
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15.EDA and DFM technologies ]i Yp  
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16.Testing and DFT technologies ~TYpq;rq  
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17.Organic semiconductor devices and technologies AYGe`{  
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18.Packaging and assembly technologies maOt/-  
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