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[会议信息][2012,4.25-27][Cannes, France][2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOE

离线stefan2005

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0楼发表于: 2012-01-24 23:17:53

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cmp.imag.fr/Conferences/dtip/dtip2012/

DTIP 2012

will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006, in 2007 in Stresa, Italy, in 2008 in Nice, France, in 2009 in Rome, Italy, in 2010 in Seville, Spain and in Aix-en-Provence, France in 2011. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.

We look forward to welcoming you to

, Côte d'Azur, France.

Topics

The topics for this Conference include (preliminary):
Technology CAD in general
Modeling and simulation of fabrication processes
Devices and components (sensors, actuators, …)
MEMS/MOEMS libraries and IP
Signal processing
Integrated CAD tools
Numerical simulation
Yield estimation
Failure mechanisms
Fault modeling
Fault simulation and test pattern generation
Mechanical simulation
Thermal evaluation
Interoperability of CAD/CAE tools
Multiphysics simulation
Structured design methodologies
Languages for interchange data among designs and tools
Model order reduction
The topics for this Conference include (preliminary):
Integrated processes (micromachining, micromolding, …)
Process integration between MEMS and electronics
Microlithography issues unique to MEMS/MOEMS
Manufacturing
Materials
Assembly technologies
Packaging for harsh environments
MOEMS packaging
RF and microwave packaging
Test structures
..

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