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[会议信息] [2011.6][Baltimore, USA][2011 International ..
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[会议信息] [2011.6][Baltimore, USA][2011 International Microwave Symposium]
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发表于: 2010-11-13 12:37:00
— 本帖被 casey 执行加亮操作(2011-06-23) —
International Microwave Symposium for 2011 (IMS2011) will be held in Baltimore, Maryland, as the centerpiece of Microwave Week 2011, from Sunday, June 5 through Friday, June 10, 2011. Baltimore hosted the IMS in 1986 and 1998 with record attendance each time.
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technical area
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[table=623][tr][td=2,1,623]
Microwave Field and Circuit Techniques
[/td][/tr][tr][td=1,1,31]
1
[/td][td=1,1,592]
Field Analysis and Guided Waves:
Novel guiding structures, new physical phenomena in transmission lines and other wave guiding structures and new analytical methods for solving guided-wave problems.
[/td][/tr][tr][td=1,1,31]
2
[/td][td=1,1,592]
Frequency-Domain EM Analysis Techniques:
Frequency-Domain methods for numerical solution of electromagnetic problems, including field interactions with devices, Circuits and with other physical processes.
[/td][/tr][tr][td=1,1,31]
3
[/td][td=1,1,592]
Time-Domain EM Analysis Techniques:
Time-Domain methods for numerical modeling of high frequency electronics, including modeling based on physical behaviors (electromagnetic, semiconductor, thermal, mechanical).
[/td][/tr][tr][td=1,1,31]
4
[/td][td=1,1,592]
CAD Algorithms and Techniques:
Circuit analysis methods, optimization methods, statistical analysis.
[/td][/tr][tr][td=1,1,31]
5
[/td][td=1,1,592]
Linear Device Modeling:
Linear models of active and passive devices, models.
[/td][/tr][tr][td=1,1,31]
6
[/td][td=1,1,592]
Nonlinear Device Modeling:
Large-signal device models, characterization, parameter extraction, validation.
[/td][/tr][tr][td=1,1,31]
7
[/td][td=1,1,592]
Nonlinear Circuit and System Simulation:
Harmonic balance, simulation techniques, distortion and spurious analysis, system simulations and behavioral modeling.
[/td][/tr][tr][td=2,1,623]
Passive Components
[/td][/tr][tr][td=1,1,31]
8
[/td][td=1,1,592]
Transmission Line Elements:
Planar, non-planar and micro machined transmission lines and waveguides, including periodic and metamaterial-type structures, discontinuities, junctions and transitions.
[/td][/tr][tr][td=1,1,31]
9
[/td][td=1,1,592]
Passive Circuit Elements:
Couplers, dividers/combiners, hybrids, resonators, lumped element approaches to circuit design.
[/td][/tr][tr][td=1,1,31]
10
[/td][td=1,1,592]
Planar Passive Filters and Multiplexers:
Innovative synthesis and analysis of planar filters and multiplexers, including planar superconducting structures.
[/td][/tr][tr][td=1,1,31]
11
[/td][td=1,1,592]
Non-planar Passive Filters and Multiplexers:
Waveguide, dielectric resonator and non-planar super conducting structures.
[/td][/tr][tr][td=1,1,31]
12
[/td][td=1,1,592]
Active, Tunable, and Integrated Filters:
Integrated filters (on Si, LTCC, LCP, MCM-D, GaAs,...) active, tunable and reconfigurable filters. Filters based on metamaterials, DGS, EBG and other structures.
[/td][/tr][tr][td=1,1,31]
13
[/td][td=1,1,592]
Ferroelectric, Ferrite, and Acoustic Wave Components:
Ferroelectric devices, bulk and thin film ferrite components, surface and bulk acoustic wave devices including FBAR devices.
[/td][/tr][tr][td=1,1,31]
14
[/td][td=1,1,592]
MEMS Components and Technologies:
RF micro electromechanical and micro machined components and subsystems: switches, resonators, tunable passive filters, phase shifters, reconfigurable filters and antennas. Modeling, packaging, reliability, novel materials and assembly processes.
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Active Components
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15
[/td][td=1,1,592]
Semiconductor Devices and Monolithic ICs:
Multifunction and monolithic integrated components: RF, microwave and millimeter-wave MMICs on GaAs, SiGe ICs and other technologies. MMIC manufacturing, reliability, failure analysis, yield and cost.
[/td][/tr][tr][td=1,1,31]
16
[/td][td=1,1,592]
Signal Generation:
CW and pulsed oscillators, VCOs, DROs, YTOs, PLOs and frequency synthesizers. Applications of new devices and resonators, noise in oscillators, DDS techniques.
[/td][/tr][tr][td=1,1,31]
17
[/td][td=1,1,592]
Frequency Conversion and Control:
Electronic switches, phase shifters, limiters, mixers, frequency multipliers and frequency dividers.
[/td][/tr][tr][td=1,1,31]
18
[/td][td=1,1,592]
HF/VHF/UHF Technologies and Applications:
Technology for HF, VHF and UHF including passive and active components, lumped and distributed elements, transmitters and receivers.
[/td][/tr][tr][td=1,1,31]
19
[/td][td=1,1,592]
Power Amplifier Devices and Circuits:
Design and performance of discrete and IC power amplifiers for RF, microwave and millimeter-wave signals, wide bandgap devices.
[/td][/tr][tr][td=1,1,31]
20
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High-Power Amplifiers:
High-power amplifier design and characterization, linearization techniques, power combining techniques, vacuum electronics.
[/td][/tr][tr][td=1,1,31]
21
[/td][td=1,1,592]
Low-Noise Components and Receivers:
Low-noise amplifiers, detectors, devices, receivers, radiometers, models and characterization methods for low-noise circuits and components.
[/td][/tr][tr][td=1,1,31]
22
[/td][td=1,1,592]
Millimeter-Wave and THz Components and Technologies:
Millimeter-Wave components, technologies and applications above 30 GHz, sub-millimeter-wave/terahertz devices, instruments and applications including THz imaging.
[/td][/tr][tr][td=2,1,623]
Systems and Applications
[/td][/tr][tr][td=1,1,31]
23
[/td][td=1,1,592]
Microwave Photonics:
Microwave/optical interactions and device technology. Wireless over fiber, free-space optical technology, broadband cable applications of photonics, optical transmissions effects.
[/td][/tr][tr][td=1,1,31]
24
[/td][td=1,1,592]
Signal Processing Circuits at GHz speeds:
High-speed mixed-signal components, modules and subsystems: ADC, DAC and DDS; backplanes, signal integrity and equalization, electrical/optical interfaces and transmission; MIMO; SDR and coherent systems.
[/td][/tr][tr][td=1,1,31]
25
[/td][td=1,1,592]
Packaging, Interconnects, MCMs and Integration:
Dielectrics and substrates, component and subsystem packaging, assembly methods, hybrid integration, interconnects and multi-chip modules (MCMs), hybrid manufacturing, yield and cost.
[/td][/tr][tr][td=1,1,31]
26
[/td][td=1,1,592]
Instrumentation and Measurement Techniques:
Network, time-domain and spectral measurements, field mapping, error correction and estimation, materials measurements.
[/td][/tr][tr][td=1,1,31]
27
[/td][td=1,1,592]
Biological Effects and Medical Applications:
Biomedical applications of microwaves, applications in biology, microwave fields and interactions in tissues.
[/td][/tr][tr][td=1,1,31]
28
[/td][td=1,1,592]
RF Arrays as Antennas and Power Combiners:
Smart antennas for wireless applications, spatial power combining, phased arrays, retro-directive systems, T/R modules, multi-beam scanning, active integrated antennas.
[/td][/tr][tr][td=1,1,31]
29
[/td][td=1,1,592]
Radar and Broadband Communication Systems:
Broadband and MMW communications systems for terrestrial, vehicular, satellite and indoor applications. Radar systems and subsystems UWB systems and subsystems.
[/td][/tr][tr][td=1,1,31]
30
[/td][td=1,1,592]
Wireless and Cellular Communication Systems:
Wireless system and transceiver architectures for 3G/4G for cellular system, WLAN, UWB, WiMax and Cognitive Radio Systems.
[/td][/tr][tr][td=1,1,31]
31
[/td][td=1,1,592]
Sensors and Sensor Systems:
IVHS, wireless micro sensors, nondestructive testing, imaging and remote sensing.
[/td][/tr][tr][td=1,1,31]
32
[/td][td=1,1,592]
RFID Technologies:
HF/UHF/RF passive and active RFID tags and readers, printed RFID's, integration of RFID's with wireless sensors and modules, RFID testing.
[/td][/tr][tr][td=1,1,31]
33
[/td][td=1,1,592]
High Power Microwave Industrial Application:
Design of microwave industrial and laboratory applications, multiphysics modeling/optimization of microwave heating systems, physics of microwave processing of materials, NDE/NDT and dielectric property measurements, systems for microwave chemistry, plasma processing, microwave sintering, microwave-assisted comminution, microwave processing of wood and food.
[/td][/tr][tr][td=2,1,623]
Emerging Technical Areas
[/td][/tr][tr][td=1,1,31]
34
[/td][td=1,1,592]
RF Nanotechnology:
carbon-, semiconductor-, and other novel-material-based nanotechnology, nanodevices and nanomaterials, metamaterials, nano-interconnects and nano-packaging, nanoantennas, nanoscale electro-mechan ..
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2010-11-13
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