[会议信息][2011.6][Florida, USA][The 61st Electronic Components and Technology Conference]

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0楼发表于: 2010-09-13 22:30:00

— 本帖被 casey 执行加亮操作(2011-06-23) —

关键词： PCB national RFID power amplifier

Submit your abstract for the 61st ECTC

May 31 - June 3, 2011
Lake Buena Vista, Florida, USA

The premier international packaging, components and microelectronic systems technology conference

You are invited to submit an abstract on your recent, previously unpublished work for the 61st ECTC representing new developments and knowledge in any of the following areas:

Advance Packaging: New technologies for advanced electronics, RF, MEMS, photonics modules, mobile platforms, systems level integration concepts, and first-level thermal solutions for high power applications, designs, and materials addressing performance, density and cooling for single chip, multichip and SIP; 3D (stacked die / PoP) packaging, MEMS, sensors, LED and high voltage packages. Special emphasis on 3D wafer integration including TSVs, wafer-to-wafer bonding, die-to-wafer bonding, die-to-die bonding and wafer thinning. Advances in flip-chip, fine-pitch and high-lead count packaging, as well as bumps, micro-bumps, TSVs, and 2D and 3D package assembly. Integration/packaging technologies related to high-performance computing, terrestrial- and space-based imaging, energy harvesting, conversion, storage, and smart grid control will also be featured.

Applied Reliability: Advances in reliability assessment and prediction at the system, PWB or package level, reliability testing and data analysis, reliability modeling of accelerated testing, reliability issues in emerging technologies, medical electronics and consumer electronics, reliability physics, reliability predictions, reliability test methods and failure analysis.

Assembly and Manufacturing Technology: Advanced process and/or equipment improvements for volume production in emerging technologies, including: Advanced packaging, 3D and 3DI packaging, SIP, SOP, bumping, flip chip, and wire bond, die thinning, handling and stacking, low-K devices, product, system level and board level assembly, electrical, mechanical, and green performance, MEMS and photonic devices, and optoelectronics.

Electronic Components and RF: RF MEMS; sensors; RFID; RF, microwave & THz components; nano-electronics & structures including power scavengers; medical devices for bio-monitoring & imaging; flexible and printed electronics; integrated antennas, filters, baluns; electronic components and modules - design, materials, processing, test, and characterization; components and modules for WLAN, UWB, WiMAX, LTE, multi-band radio applications, and mobile PC; tunable materials, structures, devices and switches; discrete passive components; integrated and embedded passive and active component integration on silicon, ceramic, and organic substrates; new technology development for components - silicon through vias, wafer level RDL, nano materials and processes.

Emerging Technologies: Design, fabrication, modeling and performance aspects of materials, devices, systems and packaging in the areas of bioelectronics, such as biomedical, bioengineering, biosensors and electronics for medical devices; organic/printable electronics; portable power supplies such as fuel cells; PWB technologies, smart packaging, devices for bio-medical imaging, green electronics and other novel packaging.

Interconnections: Interconnect innovation/design/process on all packaging levels including wire bonding, flip chip, 3D and TSV connections, first-level package, and printed circuit board. Topics may include bump and under bump metallurgy, electromigration, conductive polymers and nano-material based interconnects, novel enabling techniques, electrical performance, to environmental concerns.

Materials and Processing: Novel materials and process advancements for microelectronic systems such as 3D packages, WLP, MEMS, NEMS, optoelectronics, printed and flexible electronics, renewable energy and biomedical packaging that enhance mechanical, thermal, electrical and optical performance as well as cost effectiveness. This includes materials advances in adhesives, nanomaterials, electronic inks, dielectrics, embedded active and passives components, magnetic, optical and thermal interface materials, Pb-free solders, alloys and assembly processes.

Modeling and Simulation: Electrical, mechanical, optical, reliability, and thermal modeling, simulation, design, and characterization of chip, package, board, system, assembly, and product. Cu low-k interconnects, drop impact, lead-free solders plus power & signal integrity, fullwave modeling, equivalent circuits, macro-modeling, energy efficiency; embedded passives, multi-scale, 3D and nano-packaging, multi-physics, measurements.

Optoelectronics: Packaging and technology for optoelectronic modules, components and devices including amplifiers, transmitters, receivers, integrated photonics, passive components, fiber optics, optical sensors, chip-chip, backplanes interconnect and storage. Special interest topics include parallel optical transceivers, optical PCBs, high power lasers, high-brightness LEDs, thermal management and reliability, micro-optic packaging & manufacturing, silicon nano-photonics, and advanced optoelectronic materials.

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共1条评分

casey

rf币 +20

感谢您提供的资料，期待您继续分享！

2010-09-14

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