[会议信息][2010-12][Singapore][IEEE Electrical Design of Advanced Package & Systems Symposium]

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0楼发表于: 2010-05-17 15:01:17

— 本帖被 casey 执行加亮操作(2011-01-25) —

关键词： 2010 APS pdf ieee 学术会议

The 2010 EDAPS Symposium:

The IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) has been the premier international symposium in Asia region since it was launched in 2002 in Singapore. Thereafter, it was held in Korea in 2003, Japan in 2004, India in 2005, Shanghai China in 2006, Taiwan China in 2007, Korea in 2008, Hong Kong China in 2009. The symposium consists of paper presentations, industry exhibitions, workshops and tutorials. The 2010 EDAPS will be held in Singapore from Dec. 7 to 9, 2010.

The purpose of EDAPS Symposium is to enhance the technical awareness and technology collaborations in the Asia region specifically in the electrical designs of chip, package and system levels from design concepts, technical challenges to the modeling and EDA tools. The papers of the symposium not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, and EDA tools and most importantly to address the challenge issues in 3D IC and packaging design issues. The symposium is a major venue for creating the opportunity for the researchers and practitioners from the diverse fields to exchange information and build up the network.

Sympsoium Outline

Key Topics of the 2010 EDAPS }`ox;Q
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	Signal integrity topics including High-speed Digital Signal Integrity Modeling, Design, and Measurement;
	Power Distribution Network;
	System in Package (SiP) / System on Package (SoP) Design;
	High-performance Packaging for System on Chip (SoC);
	RF/Microwave Packaging for Wireless Communication and Mobile Phone;
	Interconnect Modeling, Simulation, and Measurement;
	Embedded Passives Modeling and Measurement;
	High-speed Channels Modeling and Measurement;
	EMI/EMC and Electromagnetic Modeling and Measurement;
	EDA Tools for Chip, Package, and Board Co-design and Simulationl

edaps2010_cfp.pdf (246 K) 下载次数:13

Date: December 7 - 9, 2010

Venue: Singapore

Tutorials / Workshops	December 7, 2010
Paper Presentations	December 8 - 9, 2010
Banquet	December, 2010
Official Tour	December, 2010

Objective of Sympsoium
The Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium is to enhance the technical awareness and depth in the Asia region specifically in area of package and system electrical design concepts, issues, and challenges ahead for next generation electronic products.

Form of Sympsoium s;e%*4
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[/td][td] Regular paper submission and accept papers by evaluation[/td][/tr][tr][td]

[/td][td] On-line submission, evaluation, and registration process[/td][/tr][tr][td][img]http://www.edaps2010.org/EDAPS2010_files/3d-ball.gif[/i ..

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共1条评分

casey

rf币 +59

感谢您的资料，加分！

2010-05-17

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