[会议信息][2010-12][Singapore][12th Electronics Packaging Technology Conference]

EPTC2010_cfp.pdf (154 K) 下载次数:11 vYXhWqL~  
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Dear Researchers, 6 A]a@,PC  
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A good day to all, k3B_M9>!  
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EPTC 2010 is schedule from 8th to 10th December 2010 in Singapore. We are in the midst of planning the conference program including keynotes, short courses as well as exhibition. We shall update details as they become available. 'Bt!X^  
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Apart from participating in EPTC 2010, you may also visit the numerous attractions of Singapore - a vibrant garden city well known for its cleanliness, safety, great shopping and glorious food. Two multi-billion-dollar integrated resorts are newly opened in 2010 for your enjoyment. -t<1A8%  
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We, therefore encourage and invite you to submit abstracts of your recent research and development work to EPTC 2010. .tfal9  
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We look forward to your participation. S\I+UeFkf  
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Yours Sincerely, ^5
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Seung Wook YOON g6DIWMoO=h  
EPTC 2010 General Chair l> H'PP~  
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IMPORTANT DATES 16I[z+RG  
Deadline for Abstract Submission: 15th June 2010 #Cs/.(<  
Notification of Acceptance: 1st August 2010 &*O'qOO<2  
Deadline for Final Manuscript Submission: 1st October 2010 V:5aq.o!  
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ABOUT ABSTRACT SUBMISSION X_Lt{mf  
Abstracts are solicited to describe original and unpublished work. The abstract should be at least 500 words and it must clearly state the purpose, results (including data, drawings, graphs and photographs) and conclusion of the work. Key references to prior publications and how the work enhances existing knowledge should be included in the abstract as well. Authors can choose between oral or poster presentation. pQ7elv]  
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Authors must designate two appropriate categories (found under CONFERENCE TOPICS) for abstract review. All submissions must be in English and should be made via the online submission system found at http://www.eptc-ieee.net. The required file format is Adobe AcrobatÒ PDF or MS Word in one single file for each submission. 1l^[%0  
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The abstracts must be received by 15th June, 2010. Authors must include their affiliation, mailing address, telephone and fax numbers, and email address. Authors will be notified of paper acceptance and publication instruction by 1st August 2010. The final manuscript for publication in the conference proceedings is due by 1st October 2010. Selected papers will be published in IEEE/CPMT journals. Z)(#D($-  
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CONFERENCE TOPICS B!)9 >  
You are invited to submit an abstract, presenting new development in the following categories: %Uoo
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•Advanced Packaging: Wafer level packaging, 3D integration, TSV (through Silicon Via) , embedded passives & actives on substrates, flip chip packaging, RF-ID, 3D SiP, Packaging solutions for MEMS and MOEMS A\7sP =  
•Interconnection Technologies: wire bonding technology, flip chip technology, solder alternatives (ICP, ACP, ACF, NCP), and TSV PK&&Vu2M  
•Materials & Processes: Materials and processes for traditional and advanced microelectronic systems, 3D packages, MEMS, solar, green and biomedical packaging UjJ&P)  
•Modeling & Simulations: Electrical modeling & signal integrity, thermal characterization & cooling solutions, mechanical modeling & structural integrity Bo ywgL|  
•Quality & Reliability: Component, board and system level reliability assessment, interfacial adhesion, accelerated testing and models, advances in reliability test methods and failure analysis h1 "#  
•Emerging Technologies: Packaging technologies in biomedical, bioengineering .. oIj/V|ByK  
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