[其它]De-Embedding Transmission Line Measurements for Accurate Modeling of IC Designs

De-embedding transmission line measurements for accurate modeling of IC designs QAcvv 0Hv  
Mangan, A.M.   Voinigescu, S.P.   Ming-Ta Yang   Tazlauanu, M.   R)G'ILneV  
Quake Technol. Inc., Ottawa, Ont., Canada; vWzNsWPK"{  
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This paper appears in: Electron Devices, IEEE Transactions on &[JI L=m5  
Publication Date: Feb. 2006 RwT.B+Onuy  
Volume: 53,  Issue: 2 VJuPC  
On page(s): 235- 241 uodO^5"-  
ISSN: 0018-9383 Zw"6-h4  
INSPEC Accession Number: 8739290 0~BQ8O=+mn  
Digital Object Identifier: 10.1109/TED.2005.861726 E/AM<eN  
Current Version Published: 2006-01-23 9.PY49|  
Abstract bCA3w%,kM  
A new technique to de-embed the contributions of parasitic structures from transmission line measurements is presented and applied to microstrip lines fabricated in 90- and 130-nm RF-CMOS technologies. De-embedded measurements are used to extract characteristic impedance, attenuation constant, group delay, and effective permittivity. The effective thickness of the ground plane is demonstrated to be as important as the thickness of the top metal layer in minimizing interconnect loss. Fur .. 9-pd{Z~l  
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