[其它]De-Embedding Transmission Line Measurements for Accurate Modeling of IC Designs

De-embedding transmission line measurements for accurate modeling of IC designs N|1J@"H  
Mangan, A.M.   Voinigescu, S.P.   Ming-Ta Yang   Tazlauanu, M.   1;.}u=8  
Quake Technol. Inc., Ottawa, Ont., Canada; `1M_rG1/+  
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This paper appears in: Electron Devices, IEEE Transactions on iO<O2A.F  
Publication Date: Feb. 2006 gJvc<]W8!  
Volume: 53,  Issue: 2 wT*`Od8w  
On page(s): 235- 241 nfRo:@  
ISSN: 0018-9383 IG
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INSPEC Accession Number: 8739290 9L!Vj J  
Digital Object Identifier: 10.1109/TED.2005.861726 05|t  
Current Version Published: 2006-01-23 % fA0XRM  
Abstract OjrQ[`(E  
A new technique to de-embed the contributions of parasitic structures from transmission line measurements is presented and applied to microstrip lines fabricated in 90- and 130-nm RF-CMOS technologies. De-embedded measurements are used to extract characteristic impedance, attenuation constant, group delay, and effective permittivity. The effective thickness of the ground plane is demonstrated to be as important as the thickness of the top metal layer in minimizing interconnect loss. Fur .. >%Y.X38Z[  
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