[原创]请教大家LTCC天线的问题

离线niuniu

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0楼发表于: 2009-02-18 23:21:35

LTCC天线是不是类似于微带天线？
它的好处是不是体积较小，可以把有源器件集成在一起
目前国内外研究的焦点是什么呢？
有没有比较应用成功的案例呢 ..

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海上日出

rf币 +2

积极参与

2009-02-18

离线zqtong

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1楼发表于: 2009-02-19 05:32:54

LTCC类似于多层的微带结构，当然你也可以设计成带线，或者悬带线。好处也在于多层，提供了很多可能性。介电常数比较高，有利于电路，不过不利于天线。以上是一点粗浅的了解。仅供参考。
顺便问一句，楼主用啥材料的？在什么应用上？

Low temperature co-fired ceramic (LTCC) is a well-established multi-layer technology which has been in use for many years in the microelectronics packaging industry. Each of the layers are processed in parallel and only brought together in an accurately aligned stack immediately prior to firing. This is the key differentiator to serially produced multi-layer structures such as thick film hybrid interconnect and components such as ceramic capacitors. LTCC technology is especially beneficial for RF and high-frequency applications. In RF and wireless applications, LTCC technology is also used to produce multilayer hybrid integrated circuits, which can include resistors, inductors, capacitors, and active components in the same package. LTCC hybrids have a smaller initial ("non recurring") cost as compared with ICs, making them an attractive alternative to ASICs for small scale integration devices.
This technology presents advantages compared to other packaging technologies such as HTCC: the ceramic is generally fired below 1000°C due to a special composition of the material. This permits the co-firing with highly conductive materials (silver, copper and gold). LTCC also features the ability to embed passive elements, such as resistors, capacitors and inductors into the ceramic package minimising the size of the completed module.
Printed resistances: In addition to embedded components, resistors may be added to the top layer post firing. Using screen printing, a resistor paste is printed onto the LTCC surface, from which resistances needed in the circuit are generated. When fired, these resistors deviate from their design value (±25%) and therefore require adjustment to meet the final tolerance . With Laser trimming one can achieve these resistances with different cut forms to the exact resistance value (±1%) desired. With this procedure, the need for additional discrete resistors can be reduced, thereby allowing a further miniaturization of the printed circuit boards.

http://en.wikipedia.org/wiki/Low_temperature_co-fired_ceramic

The Low Temperature Cofired Ceramic (LTCC) technology can be defined as a way to produce multilayer circuits with the help of single tapes, which are to be used to apply conductive, dielectric and / or resistive pastes on. These single sheets have to be laminated together and fired in one step all. This saves time, money and reduces circuits dimensions. An other great advantage is that every single layer can be inspected (and in the case of inaccuracy or damage) replaced before firing; this prevents the need of manufacturing a whole new circuit.

Because of the low firing temperature of about 850°C it is possible to use the low resistive materials silver and gold instead of molybdenum and tungsten (which have to be used in conjunction with the HTCCs).

http://www.ltcc.de/en/whatis.php

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