[数值]【IEEE Paper】High-speed PCB的SI、PI、EMI   ——电磁数值计算及仿真

自己做相关课题一年多，期间收集的IEEE文献，有不少是IEEE TRANSACTIONS。 ev$\Ns^g$3  
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【IEEE Paper】High-speed PCB的SI、PI、EMI   ——电磁数值计算及仿真，很有参考价值。 cU+%zk  
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1、A New Method for the Reduction of Crosstalk and Echo in Multiconductor Interconnections. ]rpU3 3  
2、A Novel Efficient Approach of Include Frequency-Dependent Power Delivery Effects in Bus Signal Integrity Simulation. d5hYOhO[  
3、A Sensitivity - Analysis on Design Parameters and Tolerances of Signal Integrity of High Speed Data Transfer Connectors. 3/j^Ao\fw  
4、A Signal Integrity Test Bed for PCB Buses. D (>,#F  
5、A Signal Integrity-driven Buffer Insertion Technique for Post-Routing Noise and Delay Optimization. PqhR^re0.  
6、A Study of High Speed implementation for System on Chip on 2 layers Printed Circuit Board. ?hXeZB+b4  
7、A Statistically-Enhanced Analytical Method for PCB Traces Impedance Extraction. N3Yf3rK  
8、Accurate crosstalk noise modeling for early signal integrity analysis. d[p-zn.  
9、Addressing Signal Integrity in Networks on Chip Interconnects through Crosstalk-Aware Double Error Correction Coding. gYtv`O  
10、An Effective Test Pattern Generation for Testing Signal Integrity. D;@nrj`.  
11、An integrated signal and power integrity analysis for signal traces through the parallel planes using hybrid finite-element and finitedifference time-domain techniques.Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method. {Y\W&Edw%  
12、Analysis of Power Supply Noise in the Presence of Process Variations. O:'ENoQ:&  
13、Are On-Chip Power-Ground Planes Really Needed A Signal Integrity Perspective. - s}
 
14、Behavioral Modeling for Timing, Noise, and Signal Integrity Analysis. D>Ub)i  
15、Built-In Self-Test for Signal Integrity. l[_y|W5  
16、Circuit Model for Mode Conversion in Grounded Differential Signal Paths. }r+(Z.BHM  
17、Comparative Study of Microstrip and Stripline in the Split Reference Plane of High Speed Digital Circuit Application. a___SYl 'K  
18、Comparisons Between Serpentine and Flat Spiral Delay Lines on Transient Reflection Transmission Waveforms and Eye Diagrams. 5\?\|*WT  
19、Coupling Between Differential Signals and the DC Power-Bus in Multilayer PCBs. mHiV};$  
20、Cross-SSN analysis in multilayer printed circuit boards. #%=6DHsK  
21、Cross-talk Interference Aggressor Signal Frequency Estimation in Printed Circuit Boards by means of Wavelet Signal Singularity Identification. )
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21、Decoupling Capacitors for Multi-Voltage Power Distribution Systems. >l!#_a  
22、Crosstalk Modeling for Coupled RLC Interconnects With Application to Shield Insertion. O>h,u[0  
23、Full-chip Multilevel Routing for Power and Signal Integrity. L355uaj  
24、Effect of Decoupling Capacitor on Signal Integrity in Applications with Reference Plane Change. =tS1|_  
25、Effectiveness of PCB Simulation in Teaching High-Speed Digital Design. uVQH,NA,  
26、Efficient Full-Wave Simulation of HighSpeed Printed Circuit Boards and Electronic Packages. i$[wkQ>$  
27、Efficient Signal Integrity Verification of Multi-Coupled Transmission Lines with Asynchronously Switching Non-Linear Drivers. 4IT`8n~  
28、ESTIMATION OF STRIP-LINE LOSSES IN PRINTED CIRCUIT BOARDS. 'UW(0 PXw  
29、Electromagnetic signatures A virtual test and verification tool for SoC signal integrity. s5 P~feg  
30、Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling. hI^Hqv  
31、Generalized Traveling-Wave-Based Waveform Approximation Technique for the Efficient Signal Integrity Verification of Multicoupled _~{Nco7T  
Transmission Line System. lVw77bZ  
32、High-MDSI A High-level Signal Integrity Fault Test Pattern Generation Method for Interconnects. T&ECGF;Y/  
33、Improving Signal Integrity by Optimal Design of PowerGround Plane Stack-up Structure. 0|D^_1W`R  
34、Improving Signal Integrity in Circuit Boards by Incorporating Embedded Edge Terminations. FS(bEAk}  
35、Influence of the Ground Line Position on the Signal Integrity of Product-Related Interconnects in the Frequency and Time Domain. ['*{f(AI  
36、Issues in validation of complex-valued simulations for signal integrity analysis. MHm=X8eg  
37、Modeling and Simulation of a Large Integrated Circuit Package. W`qiPLk  
38、Modeling Noise Coupling Between Package and PCB PowerGround Planes With an Efficient 2-D FDTDLumped Element Method. *i=+["A  
39、Multilevel Full-Chip Routing With Testability and Yield Enhancement. e\[z Q 2Z3  
40、On the analysis of four symmetrical interconnects for signal integrity evaluation. hJ>Kfm  
41、On-Chip Digital Jitter Measurement,from Megahertz to Gigahertz. r
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42、On-line Dynamic Delay Insertion to Improve Signal Integrity in Synchronous Circuits. Y%i=u:}fm  
43、Optimum Signal Integrity Through Appropriate Analysis of Signal Return Path and Power Delivery. &$,%6X"  
44、Power and Signal Integrity and Electromagnetic Emission; the balancing act of decoupling, planes and tracks. rmzM}T\20  
45、POWER AND SIGNAL INTEGRITY IIMPROVEMENT IN ULTRA HIGH-SPEED CURRENT MODE LOGIC. I|`/#BYbW  
46、Power Bus Signal Integrity Improvement and EMI Mitigation on Multilayer High-Speed Digital PCBs with Embedded Capacitance. lU}y%J@  
47、Practical issues in high speed PCB design. C,;hNg[  
48、Reliable Eye-Diagram Analysis of Data Links via Device Macromodels. {#Lj,o  
49、Signal integrity analysis of high-speed interconnects through a full-wave transmission line model. ~)ecQ  
50、Signal Integrity Analysis of Interconnects Using the FDTD Method and a Layer Peeling Technique. "L(4 EcO@  
51、Signal Integrity Analysis of High-speed, High-Pin-Count Digital Packages. g}vOp3^  
52、Signal integrity analysis of the traces in electromagnetic-bandgap structure in high-speed printed circuit boards and packages. kwcH$w<I  
53、Signal Integrity Analysis with Power Delivery Network. s%{8$>8V.  
54、Signal integrity of bent differential transmission lines. BeNH"Y:E  
55、Signal Integrity Check by Simulation to Improve PCB Performance. n)n>|w_  
56、Signal Integrity Impact of Ultra Low Power IO Initiatives. kPt] [1jo  
57、Simulation of High-Speed Distributed Interconnects Using Krylov-Space Techniques. ?tf/#5t}  
58、Simulation of Crosstalk on Printed Circuit Boards by FDTD, FEM, and a Circuit Model. D^[}:O{  
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