[设计与测试]【pdf】【1.0M】高速PCB设计的模拟、RF和EMC

Introduction Introduction wD9a#AgEd  
♦ Advances in digital and analog technologies present new #$1$T  
challenges PWB design &=q! Wdw~  
♦ Clock frequencies approach the L Band region vv5i? F  
- Dielectric absorption, Skin Depth, Impedances, Dispersion B@K[3  
♦ High Power and/or Lower Voltage tS?lB05TOR  
- Power distribution, decupling Ill[]O  
♦ High dynamic-range/low-noise analog circuitry yp]@^TN  
- Noise immunity, stability 3'eG;<F  
♦ High Density Components s3QEi^~
 
- Xilinx FG1156 Fine Pitch BGA (1.0 mm pitch 39 mils) 9O98Q6-s  
- Finer pitch BGAs 0.8 mm (31 mils) and 0.5 mm (20 mils) 8<&EvOk  
♦ Overlap between Disc .. H%i>L?J2/  
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