[设计与测试]【pdf】【1.0M】高速PCB设计的模拟、RF和EMC

Introduction Introduction AB<%GzW0(  
♦ Advances in digital and analog technologies present new U#{(*)qr  
challenges PWB design Hxn#vAc  
♦ Clock frequencies approach the L Band region gw$?&[wY  
- Dielectric absorption, Skin Depth, Impedances, Dispersion >?.jN|  
♦ High Power and/or Lower Voltage 8[#EC3  
- Power distribution, decupling FM|3'a-z  
♦ High dynamic-range/low-noise analog circuitry ndw&F'.r  
- Noise immunity, stability 0D0uzUD-
 
♦ High Density Components u(8dsgR  
- Xilinx FG1156 Fine Pitch BGA (1.0 mm pitch 39 mils) z`,dEGfh^  
- Finer pitch BGAs 0.8 mm (31 mils) and 0.5 mm (20 mils) IA$=  
♦ Overlap between Disc .. ;O~%y'  
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