[设计与测试]【pdf】【1.0M】高速PCB设计的模拟、RF和EMC

Introduction Introduction 5n_<)Ycj  
♦ Advances in digital and analog technologies present new z=!xN5  
challenges PWB design ~ ^K[pA ?  
♦ Clock frequencies approach the L Band region r!;NH3 *  
- Dielectric absorption, Skin Depth, Impedances, Dispersion NJ|8##Z>  
♦ High Power and/or Lower Voltage s)}C&T$Y.  
- Power distribution, decupling 8 }-"&-X  
♦ High dynamic-range/low-noise analog circuitry K\uR=L7  
- Noise immunity, stability }%%| '8  
♦ High Density Components 4h-y'&Z  
- Xilinx FG1156 Fine Pitch BGA (1.0 mm pitch 39 mils) oM< 9]jK}  
- Finer pitch BGAs 0.8 mm (31 mils) and 0.5 mm (20 mils) =!Ok079{[  
♦ Overlap between Disc .. n#4Ra+dD  
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