[分享]【pdf】【638k】Emc Design Guide For Pcb

Emc Design Guide For Pcb FMuM:%&J]  
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EMC Design Guide for Printed Circuit Boards [dL4u^]{  
TABLE OF CONTENTS jYRwtP\  
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  ................................................................................................................8 }}v;V*_V  
PART I: PREFACE 
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1. INTRODUCTION..................................................................................................................8 WLEjRx  
  ................................................................................................9 a="Z]JGk  
PART II: GENERAL EMC ]z,W1Zs?  
2. EMC OVERVIEW..................................................................................................................9 XFPWW,  
2.1. The Elements..................................................................................................................9 $z]gy]F  
2.2. The Environment..........................................................................................................10 xGJ{_M  
2.3. Regulations and Standards............................................................................................11 Im1e/F]  
2.4. Elements of EMI...........................................................................................................12 &'UYV>  
  ....................................................................................14 m0W5Ogk  
PART III: DESIGN APPROACH `6b!W0$ -  
3. OVERVIEW.........................................................................................................................14 i!<,8e=  
3.1. Design Approach for Immunity (Susceptibility)..........................................................14 }N1Z7G  
3.1.1. Design Approach for Radiated Immunity.............................................................14 /z*?:*  
3.1.2. Design Approach for ESD.....................................................................................14 TDdFuO'}  
3.2. Design Approach for Controlling Radiated and Conducted Emissions........................14 e;56}w  
3.3. Ground System..............................................................................................................15 UfSWd
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3.4. Wavelength and Frequency...........................................................................................19 g6k@E,cI_  
3.5. Frequency Domain of Digital Signals...........................................................................22 'QjX2ytgX  
3.6. Radiated Emissions Predictions....................................................................................24 jAmAT/1  
3.7. Crosstalk.......................................................................................................................28 c.Pyt  
3.7.1. Common Impedance Coupling..............................................................................29 ,YJ\ $?  
3.7.2. Capacitive and inductive coupling........................................................................30 Q_xE:#!;  
3.7.3. Capacitive coupling...............................................................................................30 ~fn2B  
3.7.4. Inductive coupling.................................................................................................33 H3}{]&a  
3.8. Twisted Pair..................................................................................................................36 eZ y)>.6Z  
3.9. Shielding.......................................................................................................................37 1K&z64Q5J  
3.10. Resistance.....................................................................................................................40 J.mEOo!>  
3.11. Inductance....................................................................................................................41 9. Q;J#;1  
  ..................................................46 LZV  
PART IV: IC RE MEASUREMENT PROCEDURE tB4- of3+  
4. SCOPE..................................................................................................................................46 w%)=`'s_  
4.1. Applicable Documents..................................................................................................46 qCn(~:  
4.2. EMC Test Recommendations.......................................................................................47 xCD|UC46?X  
4.3. Test Procedure Applicability........................................................................................47 ^$DpdzI  
4.4. IC Emissions Reference Levels....................................................................................48 )R+@vh#Q<$  
4.4.1. Level 1...................................................................................................................49 ~oh=QakW  
4.4.2. Level 2...................................................................................................................49 Y(ly0U}  
4.4.3. Level 3...................................................................................................................49 NA>h$N  
4.4.4. Level 4...................................................................................................................50 DHJh.Y@H  
4.4.5. Level NR................................................................................................................50 _) 2fXG!  
4.5. Data Submission...........................................................................................................50 b2. xJ4  
4.6. Radiated and Conducted Immunity..............................................................................50 {n=)<w  
  ..................................................51 .0S.7w3dZo  
PART V: EMC DESIGN GUIDELINES FOR PCB 9`+c<j4/B  
5. GENERAL............................................................................................................................51 Ps(3X@  
5.1. Board Structure/Ground Systems.................................................................................52 6$w)"Rq  
5.2. Power Systems..............................................................................................................57 *;8tj5du  
Frame  ii  of  78  Rev. A 10/01/2002 !9DqW&8  
Printed copies are uncontrolled 8'_>A5L/C  
Engineering Specification ES-3U5T-1B257-AA ZkkXITQkPM  
EMC Design Guide for Printed Circuit Boards qdrk.~_  
5.3. Digital Circuits..............................................................................................................61  d>}pz  
5.4. Analog Circuits.............................................................................................................64 f*7/O |Gp  
5.5. Communication Protocols.............................................................................................65 7\'vSHIL  
5.6. Shielding.......................................................................................................................65 _`|Hk2O  
5.7. Miscellaneous...............................................................................................................67 f@+[
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  ...........................................................................................69 (Kd;l&8  
PART VI: REQUIREMENTS bWo-( qxq  
6. MANAGEMENT OF CHANGE FOR EMC.......................................................................69 2c@R!*  
6.1. Radiated Immunity:......................................................................................................69 ~sshhuF  
6.1.1. For safety critical systems (containing one or more Class C functions)...............69 h
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6.1.2 For non-safety critical systems..............................................................................70 1 e1$x@\\  
6.2. Conducted immunity:........................ .. (Sr&
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