[分享]【pdf】【638k】Emc Design Guide For Pcb

Emc Design Guide For Pcb <V0]~3  
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EMC Design Guide for Printed Circuit Boards ER<LP@3k  
TABLE OF CONTENTS =7wI/5iN  
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  ................................................................................................................8 8+5#FC7  
PART I: PREFACE q}p&<k  
1. INTRODUCTION..................................................................................................................8 '!^5GSP3&  
  ................................................................................................9 0+%{1JkJq  
PART II: GENERAL EMC GM=r{F &  
2. EMC OVERVIEW..................................................................................................................9 ^0py  
2.1. The Elements..................................................................................................................9 ]Qm$S5tU  
2.2. The Environment..........................................................................................................10 XFKe6:  
2.3. Regulations and Standards............................................................................................11 9z6-HZG'~<  
2.4. Elements of EMI...........................................................................................................12 t>"UenJt-  
  ....................................................................................14 jcD_<WSe  
PART III: DESIGN APPROACH "c` $U]M%  
3. OVERVIEW.........................................................................................................................14 #pO=\lJ
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3.1. Design Approach for Immunity (Susceptibility)..........................................................14 8'[g?  
3.1.1. Design Approach for Radiated Immunity.............................................................14 kN_ i0~y@-  
3.1.2. Design Approach for ESD.....................................................................................14 EKo!vieG  
3.2. Design Approach for Controlling Radiated and Conducted Emissions........................14 i#]}k  
3.3. Ground System..............................................................................................................15 L"{qF<@V7&  
3.4. Wavelength and Frequency...........................................................................................19 hAX@|G.  
3.5. Frequency Domain of Digital Signals...........................................................................22 rT7W_[&P  
3.6. Radiated Emissions Predictions....................................................................................24 6RV42r^pf  
3.7. Crosstalk.......................................................................................................................28 IA I!a1e!  
3.7.1. Common Impedance Coupling..............................................................................29 ~(bY-6z  
3.7.2. Capacitive and inductive coupling........................................................................30 67/JsL  
3.7.3. Capacitive coupling...............................................................................................30 9"hH2jc  
3.7.4. Inductive coupling.................................................................................................33 uNSaw['0j  
3.8. Twisted Pair..................................................................................................................36 mrWPTCD{  
3.9. Shielding.......................................................................................................................37 'ol8lIa.P  
3.10. Resistance.....................................................................................................................40 s)C5u;3!  
3.11. Inductance....................................................................................................................41 Ey96XJV  
  ..................................................46 [Z9 lxZ|  
PART IV: IC RE MEASUREMENT PROCEDURE 1c8Nr&Jl  
4. SCOPE..................................................................................................................................46 HO[W2b  
4.1. Applicable Documents..................................................................................................46 ~SUrbRaY>  
4.2. EMC Test Recommendations.......................................................................................47 @i2"+_}*  
4.3. Test Procedure Applicability........................................................................................47 9'+Eu)l:  
4.4. IC Emissions Reference Levels....................................................................................48 .UX`@Q:Gp  
4.4.1. Level 1...................................................................................................................49 ;]c@%LX  
4.4.2. Level 2...................................................................................................................49 z,dh?%H>X  
4.4.3. Level 3...................................................................................................................49 hS&3D6Gt  
4.4.4. Level 4...................................................................................................................50 35=kZXwG+4  
4.4.5. Level NR................................................................................................................50 )N$T&  
4.5. Data Submission...........................................................................................................50 8*o*?1.  
4.6. Radiated and Conducted Immunity..............................................................................50 8p D$
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  ..................................................51 BV)oF2b:  
PART V: EMC DESIGN GUIDELINES FOR PCB @9#l3  
5. GENERAL............................................................................................................................51 !jlLF:v|1A  
5.1. Board Structure/Ground Systems.................................................................................52 -
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5.2. Power Systems..............................................................................................................57 j'r"_*%  
Frame  ii  of  78  Rev. A 10/01/2002 !2L?8oP-z  
Printed copies are uncontrolled ?1Os%9D*  
Engineering Specification ES-3U5T-1B257-AA -wn,7;  
EMC Design Guide for Printed Circuit Boards /c2| *"@X  
5.3. Digital Circuits..............................................................................................................61 >}<1  
5.4. Analog Circuits.............................................................................................................64 1.Kun !w  
5.5. Communication Protocols.............................................................................................65 1OI/!!t1$  
5.6. Shielding.......................................................................................................................65 ;B*im S10  
5.7. Miscellaneous...............................................................................................................67 =T"R_3[NC  
  ...........................................................................................69 C\2rSyo  
PART VI: REQUIREMENTS 3 UUOB.  
6. MANAGEMENT OF CHANGE FOR EMC.......................................................................69 A1>fNilC9  
6.1. Radiated Immunity:......................................................................................................69 )&/ecx"
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6.1.1. For safety critical systems (containing one or more Class C functions)...............69 pGZiADT  
6.1.2 For non-safety critical systems..............................................................................70 xs#g  
6.2. Conducted immunity:........................ .. (~S=DFsP  
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