[分享]【pdf】【638k】Emc Design Guide For Pcb

Emc Design Guide For Pcb B-@f.NO/s  
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EMC Design Guide for Printed Circuit Boards pKr3(5~  
TABLE OF CONTENTS jVfC4M7 ,  
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  ................................................................................................................8 $?*+P``  
PART I: PREFACE fK4laDBTO  
1. INTRODUCTION..................................................................................................................8 em>CSBx  
  ................................................................................................9 "_H&p  
PART II: GENERAL EMC M{~eI  
2. EMC OVERVIEW..................................................................................................................9 T,WWQm  
2.1. The Elements..................................................................................................................9 TuaT-Z~U{  
2.2. The Environment..........................................................................................................10 zYls>fbp,  
2.3. Regulations and Standards............................................................................................11 WY*}
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2.4. Elements of EMI...........................................................................................................12 v7&$(HJ>]L  
  ....................................................................................14 [K"v)B'  
PART III: DESIGN APPROACH }d6g{`  
3. OVERVIEW.........................................................................................................................14 &<tji8Dj  
3.1. Design Approach for Immunity (Susceptibility)..........................................................14 Ir0er~f+z  
3.1.1. Design Approach for Radiated Immunity.............................................................14 +XY}-  
3.1.2. Design Approach for ESD.....................................................................................14 <a$cB+t  
3.2. Design Approach for Controlling Radiated and Conducted Emissions........................14 ef!I |.FW  
3.3. Ground System..............................................................................................................15 *qz]vUb/0  
3.4. Wavelength and Frequency...........................................................................................19 jj.]R+.G  
3.5. Frequency Domain of Digital Signals...........................................................................22 ~PoGuj2wA  
3.6. Radiated Emissions Predictions....................................................................................24 z,2m7C  
3.7. Crosstalk.......................................................................................................................28 rWbL_1Eq  
3.7.1. Common Impedance Coupling..............................................................................29 l#Qf8*0  
3.7.2. Capacitive and inductive coupling........................................................................30 .3ic%u;|D  
3.7.3. Capacitive coupling...............................................................................................30 v'_tna6`O  
3.7.4. Inductive coupling.................................................................................................33 vP,WV9Q1u  
3.8. Twisted Pair..................................................................................................................36 N>]u;HjH  
3.9. Shielding.......................................................................................................................37 y{v*iH<  
3.10. Resistance.....................................................................................................................40 [FC%_R&&  
3.11. Inductance....................................................................................................................41 K32eZv`T7  
  ..................................................46 ?.4.Ubc\  
PART IV: IC RE MEASUREMENT PROCEDURE <D&75C#  
4. SCOPE..................................................................................................................................46 ?d_<S0j-)  
4.1. Applicable Documents..................................................................................................46 aP"i_!\.aa  
4.2. EMC Test Recommendations.......................................................................................47 yM\1n  
4.3. Test Procedure Applicability........................................................................................47 c=@=lGgo  
4.4. IC Emissions Reference Levels....................................................................................48 t%FS 5  
4.4.1. Level 1...................................................................................................................49 Y61E|:fV!  
4.4.2. Level 2...................................................................................................................49 F$+_Z~yt3;  
4.4.3. Level 3...................................................................................................................49 }cS3mJ  
4.4.4. Level 4...................................................................................................................50 :+-s7'!4  
4.4.5. Level NR................................................................................................................50 D_, 2z  
4.5. Data Submission...........................................................................................................50 BA-n+WCWJ  
4.6. Radiated and Conducted Immunity..............................................................................50 x6$P(eN  
  ..................................................51 \!w7N :m  
PART V: EMC DESIGN GUIDELINES FOR PCB $1?YVA7  
5. GENERAL............................................................................................................................51 >!a*wf~]  
5.1. Board Structure/Ground Systems.................................................................................52 /iukiWeW  
5.2. Power Systems..............................................................................................................57 wHIS}OONz  
Frame  ii  of  78  Rev. A 10/01/2002 d6M d~$R  
Printed copies are uncontrolled > }:6m  
Engineering Specification ES-3U5T-1B257-AA 9ykmz (  
EMC Design Guide for Printed Circuit Boards W?6RUyMC$T  
5.3. Digital Circuits..............................................................................................................61 Z ,T TI>P  
5.4. Analog Circuits.............................................................................................................64 ?cpID8Z  
5.5. Communication Protocols.............................................................................................65 !PQ@"L)p  
5.6. Shielding.......................................................................................................................65 ryPz?Aw(4  
5.7. Miscellaneous...............................................................................................................67 :!r_dmJ  
  ...........................................................................................69 cFH,fj  
PART VI: REQUIREMENTS ,l@hhaLm?  
6. MANAGEMENT OF CHANGE FOR EMC.......................................................................69 'etCIl3  
6.1. Radiated Immunity:......................................................................................................69 W6\s@)b;  
6.1.1. For safety critical systems (containing one or more Class C functions)...............69 ,u\M7,a^  
6.1.2 For non-safety critical systems..............................................................................70 ?!A{n3\<  
6.2. Conducted immunity:........................ .. qbT].,?!U  
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