[分享]【pdf】【254k】EMC Design for Notebook Applications

EMC Design for Notebook Applications :4Vt  
w$!n8Aqs  
TABLE OF CONTENTS wDG4rN9x  
1. INTRODUCTION...............................................................................................................................4 'mM5l*{  
2. MECHANICAL CONSTRUCTION...................................................................................................4 ,O+7nByi[V  
2.1. USING CONDUCTIVE PLASTICS AND COATED PLASTICS......................................................................4 ] ge-b\  
2.2. METAL CHASSIS..............................................................................................................................6 Tk:y>P!%a  
2.3. APERTURES.....................................................................................................................................8 .PxM #;i2  
2.4. HINGES (NOTEBOOK PC APPLICATIONS)...........................................................................................9 _Owz%  
2.5. SIGNAL CABLES.............................................................................................................................10 nNKL{Hp  
2.6. CONTACT POINTS..........................................................................................................................13 hU{%x#8}lK  
2.7. SUMMARY.....................................................................................................................................16 EKf4f^<  
3. GENERAL ELECTRICAL CONSIDERATIONS...........................................................................18 -d~'tti  
3.1. CAPACITIVE DECOUPLING..............................................................................................................18 G~Sfpf  
3.2. GROUND PLANES...........................................................................................................................19 1,J.  
3.2.1. PCB Layout, Ground Planes and ESD...................................................................................21 1XKk~G"D  
3.3. POWER PLANES AND POWER LINES.................................................................................................22 8K/lpqw  
3.4. FILTERING.....................................................................................................................................23 K
na'5L5"  
3.5. FERRITES ......................................................................................................................................26 l9h;dI{6  
3.6. SUMMARY.....................................................................................................................................27 =EJ"edw]%0  
TM 6M9rC[h\  
4. PanelLink  APPLICATION CONSIDERATIONS.....................................................................28 ;a`X|N9  
4.1. CAPACITIVE DECOUPLING..............................................................................................................28 ao!r6:&v$e  
4.2. PARALLEL DATA LINE LOADING.....................................................................................................29 U{Z>y?V/  
4.3. POWER DISTRIBUTION AND GROUND PLANES..................................................................................30 KPhqD5, (  
4.4. SIGNAL CABLE CONFIGURATION ....................................................................................................31 dw|0K+-PH  
4.5. FILTERING.....................................................................................................................................33 /~[R u  
4.6. ESD PROTECTION......... .. @n(In$  
2 *$n?  

未注册仅能浏览部分内容，查看全部内容及附件请先 登录 或 注册

Thanks Thanks

Thanks Thanks

okkkkkkkkkkkkkk

Thanks Thanks