[分享]【pdf】【254k】EMC Design for Notebook Applications

EMC Design for Notebook Applications ?Jtg3AY  
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TABLE OF CONTENTS yO>V/5`  
1. INTRODUCTION...............................................................................................................................4 [W,-1.$!dM  
2. MECHANICAL CONSTRUCTION...................................................................................................4 sx
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2.1. USING CONDUCTIVE PLASTICS AND COATED PLASTICS......................................................................4 s-VSH  
2.2. METAL CHASSIS..............................................................................................................................6 y/@iT8$rp  
2.3. APERTURES.....................................................................................................................................8 )J3kxmlzQ  
2.4. HINGES (NOTEBOOK PC APPLICATIONS)...........................................................................................9 Gr(|Ra.  
2.5. SIGNAL CABLES.............................................................................................................................10 HpexH{.u)  
2.6. CONTACT POINTS..........................................................................................................................13 7nHTlI1b  
2.7. SUMMARY.....................................................................................................................................16 #rYENR[  
3. GENERAL ELECTRICAL CONSIDERATIONS...........................................................................18 [Id}4[={e  
3.1. CAPACITIVE DECOUPLING..............................................................................................................18 H%z@h~s>  
3.2. GROUND PLANES...........................................................................................................................19 +TRy:e  
3.2.1. PCB Layout, Ground Planes and ESD...................................................................................21 em]xtya  
3.3. POWER PLANES AND POWER LINES.................................................................................................22 I2HT2c$  
3.4. FILTERING.....................................................................................................................................23 i`OrMzL  
3.5. FERRITES ......................................................................................................................................26 W%!@QY;E(  
3.6. SUMMARY.....................................................................................................................................27 [ev-^[  
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4. PanelLink  APPLICATION CONSIDERATIONS.....................................................................28 ]9S`[c$  
4.1. CAPACITIVE DECOUPLING..............................................................................................................28 }+Vv0jX|V  
4.2. PARALLEL DATA LINE LOADING.....................................................................................................29 <V_7|)'/A  
4.3. POWER DISTRIBUTION AND GROUND PLANES..................................................................................30 a1MFjmq  
4.4. SIGNAL CABLE CONFIGURATION ....................................................................................................31 $X+u={]  
4.5. FILTERING.....................................................................................................................................33 u:`y]  
4.6. ESD PROTECTION......... .. \T-~JQVj  
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