[分享]【pdf】【254k】EMC Design for Notebook Applications

EMC Design for Notebook Applications ^~(@QfY  
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TABLE OF CONTENTS <`n T+c  
1. INTRODUCTION...............................................................................................................................4 6[w_/X"  
2. MECHANICAL CONSTRUCTION...................................................................................................4 Y!"LrkC  
2.1. USING CONDUCTIVE PLASTICS AND COATED PLASTICS......................................................................4 .kyp5CD}4  
2.2. METAL CHASSIS..............................................................................................................................6 3~%9;.I3!  
2.3. APERTURES.....................................................................................................................................8 "0pu_  
2.4. HINGES (NOTEBOOK PC APPLICATIONS)...........................................................................................9 W(Xb]t=19  
2.5. SIGNAL CABLES.............................................................................................................................10 c|IH|y  
2.6. CONTACT POINTS..........................................................................................................................13 o[&*vc)  
2.7. SUMMARY.....................................................................................................................................16 48W$,  
3. GENERAL ELECTRICAL CONSIDERATIONS...........................................................................18 4ZSc'9e9  
3.1. CAPACITIVE DECOUPLING..............................................................................................................18 AEp|#H' >  
3.2. GROUND PLANES...........................................................................................................................19 &O7]e3Ej  
3.2.1. PCB Layout, Ground Planes and ESD...................................................................................21 E&#cU}ErN  
3.3. POWER PLANES AND POWER LINES.................................................................................................22 L;wzvz\+  
3.4. FILTERING.....................................................................................................................................23 "NMX>a,(  
3.5. FERRITES ......................................................................................................................................26 =c[9:&5Q  
3.6. SUMMARY.....................................................................................................................................27 aF]4%E  
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4. PanelLink  APPLICATION CONSIDERATIONS.....................................................................28 p0
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4.1. CAPACITIVE DECOUPLING..............................................................................................................28 1T!(M"'Ij  
4.2. PARALLEL DATA LINE LOADING.....................................................................................................29 v[A)r]"j"M  
4.3. POWER DISTRIBUTION AND GROUND PLANES..................................................................................30 !^:b?M  
4.4. SIGNAL CABLE CONFIGURATION ....................................................................................................31 nj]l'~Y0  
4.5. FILTERING.....................................................................................................................................33 [x{'NwP?  
4.6. ESD PROTECTION......... ..
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