[资料]毫米波天线封装互连(硕士论文PDF下载)

[post]
The increase in mobile network data usage has led to interests in mm-wave frequencies (for example 26.5 GHz – 29.5 GHz) on becoming fifth generation (5G) networks in addition to previously used sub-6 GHz frequencies. The advantage of mm-wave frequencies is larger bandwidth, leading to larger throughput with a tradeoff of smaller coverage due to shorter wavelength. The coverage issue can be compensated by using
antenna arrays instead of one antenna. There have been some studies about stacking antenna module package vertically on motherboard, and in more advanced approach, the RFIC is integrated into the bottom of the antenna module package.

This thesis concentrates on developing the interconnection between two PWBs on mm-wave frequency (26.5 GHz – 29.5 GHz) between the antenna module and motherboard. More accurately, creating interconnection around via structure, carrying RF-signal from antenna module to motherboard by applying vertical stacking. This method may reduce the overall price of the system, while increasing the level of integration in the system. The
overall aim of this thesis was to provide a functional and optimized interconnection method with measurement results and limitations of Nokia Factory.

The interconnection can be created by using electromagnetic coupling or galvanic connection. The galvanic connection was chosen for many reasons and different interconnection methods applying galvanic connection were introduced. These methods include LGA and BGA soldering, traditional RF-connector and antenna array connector with 16-ports. After considering the options and Nokia Factory limitations, the most suitable interconnection method turned out to be LGA soldering.

The research work includes partial design of antenna module and motherboard, and the optimization for connection. Prototypes were created based on the design, and the measurement results and conclusions of interconnection functionality were provided as well. Six prototypes were made, from which prototypes 3-6 were functional in terms of solder height. The measurement results show that there was variation in matching between different prototypes and between simulation and measurement results. By doing x-ray and failure analysis, a few reasons were found to explain the variation. One reason can be found from voids in signal soldering, which widens the soldering horizontally, leading to decreased matching due to changed solder diameter and asymmetric grounding. However, by utilizing the solder bumping method, the appearance and diameter of voids can be minimized.

The conclusion ..

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多谢楼主分享！

多谢楼主分享！

学习，谢谢。

多谢分享

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好东西，谢谢

好东西，有没有IEEE的文章代下呀

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