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2013.03 北京 EDI CON 电子设计创新会议
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2013.03 北京 EDI CON 电子设计创新会议
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yueyongbo
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发表于: 2013-01-02 10:29:33
March 12-14, 2013
in Beijing, China.
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A new kind of technical conference and trade show, developed for and by the
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high-frequency/high-speed electronics industry and Microwave Journal China.
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About the Conference
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The Electronic Design Innovation Conference provides an opportunity for design engineers and system integrators to learn about the latest RF/microwave and high speed digital products and technologies for today’s communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. With a focus on applications, emerging technologies and practical engineering solutions, this annual event brings together the designers at the forefront of Chinese innovation and the world’s leading multi-national technology companies. The HF/HS Electronic Design Innovations Conference includes keynotes presentations from industry executives and government officials, technical presentations, workshops, expert panels, exhibitor showcase and networking reception. The 2 day inaugural event will be held
March 12-14, 2013
in Beijing, China.
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Tuesday Opening Program
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Welcome Message General Chair
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1:30
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Keynote Plenary Themes (Industrial resources supporting indigenous design/Government interest in professional growth and development.)
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3:00 - 5:00
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TBD
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5:00 - 7:00
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Welcome Reception and Networking Event
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Wednesday Technical Tracks
- Design, Measure/Model, System
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Session Two
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10:00 - 10:15
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Coffee Break
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10:15 - 11:00
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Session Three
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11:00 - 11:45
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Session Four
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Vendor Exhibition
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Wednesday Panels & Workshops/Tutorials
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Session Two
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Optional Workshops
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Thursday Technical Tracks
- Design, Measure/Model, System
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Coffee Break
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Thursday Panels & Workshops/Tutorials
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3:00 - 4:00
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Optional Workshops
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很遗憾，貌似Call for paper 的日期已经过了，不过看到论坛上还没有 发上来给大家分享一下。
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A new kind of technical conference and trade show, developed for and by the
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high-frequency/high-speed electronics industry and Microwave Journal China.
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Technical Paper Sessions
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Technical Paper Sessions
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The technical paper sessions at EDI CON are educational in nature, providing practical information to electronics designers and engineers. The sessions offered are designed to provide knowledge of electronic design tools and techniques. Four morning sessions are divided into three concurrent technical tracks. Each session will feature two twenty-minute long technical papers from invited contributors or selected from papers submitted to the EDI CON Technical Advisory Committee. The technical tracks focus on a range of high frequency/high speed electronic design issues from component characterization through system integration.
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RF, Microwave & High-Speed Digital Design Track
Measurement & Modeling Track
Systems Engineering Track
Submitting a Technical Paper Proposal:
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Authors are invited to submit technical paper proposals describing original work in RF, microwave and high-speed digital electronic component or system-level design. Acknowledging the diversity of methods available today, EDI CON technical papers will be accepted in various formats including traditional paper and PowerPoint presentations. Regardless of format, submissions must be high quality and robust, aimed at advancing the knowledge of attendees. Authors must submit a summary of the proposed presentation electronically to the e-mail address below by
August 31, 2012
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The proposal may be submitted in any one of the following formats:
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1. Copy of draft or final paper
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2. Comprehensive abstract
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3. PowerPoint (or PDF created from PowerPoint)
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Any submitted abstract or PowerPoint/PDF document must contain a sufficient level of detail in order to provide reviewers with a reasonable understanding of the work to be offered in the final presentation. Presentations and abstracts without sufficient information will automatically be rejected. Submitted papers and abstracts should be in a MS Word document.
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Submissions can contain mathematical formulas, any derivations of which should be placed in appendices. Images can include pictures or illustrative graphics such as cutaways, schematics and graphs. Submitting a final technical paper in addition to the speaker presentation is optional and (accepted papers) will be made available to all delegates in the technical program. Technical papers should run between 2,000 and 3,000 words with a maximum of 6 figures. Submissions will be evaluated per the criteria described below in this document.
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Indicate name, affiliation and full contact information, and desired technical track.
Submit title and full abstract.
Proposal should be prepared in English or Simplified Chinese.
Proposal should be delivered to
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Proposals must be received by August 31, 2012
Important Dates:
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May 25th
– Initial Call for Papers and Invitations to submit
August 31st
– Material deadline for submitting paper proposals, includes title and abstract/summary. Initial drafts also accepted.
October 31st
– Notification of acceptance
January 30th
– Final manuscript due.
Technical Paper Proposal Review Process:
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The EDI CON Technical Advisory Committee will review all submissions based on quality, relevance, impact, and originality. Prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, as long as product references add to the educational value and are presented in an appropriately non-commercial fashion.
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- Criteria for acceptance
Quality – EDI CON papers should be well organized and easily understood. The proposal abstract and summary are judged as indicators of what can be expected of the prospective authors for a full-length paper.
Relevance – The proposed paper should be highly relevant to the interests of the EDI CON audience in general and the track topic in particular.
Impact – EDI CON papers should contribute to the educational mission of EDI CON, furthering the technical expertise of conference delegates. Submissions reporting on important results, methodologies or case studies of special significance will be considered favorably.
Originality – Reports on new design methodologies, case studies for innovative designs or other novel results contribute to the EDI CON goal of providing a high-quality educational program for practicing engineers. Outstanding papers on “classical” topics that help educate delegates on fundamental concepts, especially in the areas of new communication standards (i.e. TD-LTE, carrier aggregation, MIMO) will also be viewed favorably.
Commercial content – It is acceptable to use a product in a design case study or as a proof of concept for a design methodology. Product promotion is not permitted in EDI CON technical sessions. Product promotion in a paper proposal will lead to rejection of the proposal or the removal of promotional language from the paper by the technical advisory committee.
Overview of Suggested Topics:
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RF, Microwave & High-Speed Digital Design Track includes the following topics:
LNA Design
RF/microwave Filter and Diplexer Design
Power Amplifier design
Design optimization for efficiency and linearity
Linearization and pre-distortion techniques
Thermal effects and proper heat-sinking techniques
RF Power Management
Antenna designs
Combining/dividing structures
Oscillator and resonator Design
Mixer, Switch and Frequency multiplier/divider design
Designing for low jitter
Chip/Package/Board co-design
Interconnect design for SI and PI.
Measurement & Modeling Track includes the following topics:
Active device modeling
Nonlinear measurements
Passive Device modeling and EM simulations/optimization
RF measurement techniques for high speed design
Working with S-parameters in the time domain
Behavioral models
Model representation in RF simulation
Load pull techniques
Material Characterization
Package modeling
Working with advanced materials (meta, nano, etc.)
Advanced RF/mW semiconductors (GaN, GaAs, LDMOS, etc.)
Understanding and modeling Phase Noise
Thermal modeling/multi-physics analysis
Systems Engineering Track includes the following topics:
Lower Power RF- i.e. Zigbee, NFC
BuNGee
Understanding TD-LTE
802.11 ac/ad
MIMO OTA Testing
EMI/EMC
RFID
Remote Sensing
SATCOM
M2M
Backhaul
Millimeter wave Systems for point-to-point radio
RADAR systems
Software defined radio
Automatic Test Systems
Speaker Benefits and Responsibilities:
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In over 50 years of publication, Microwave Journal and its editorial review process has earned a reputation for printing only the highest quality technical articles focusing on new and innovative technological developments in the RF and microwave field. Technical papers accepted for EDI CON will adhere to the same standards of excellence through a similar peer review process so that EDI CON delegates will have access to the highest-quality, unbiased, practical technical information. If accepted into the program, speakers are automatically registered and will receive complimentary admission to classes and tutorials.
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Papers accepted by EDI CON will appear in the conference program provided to delegates or made available through purchase from Microwave Journal and EDI CON.
Accepted papers will also be eligible for publication by Microwave Journal and/or Microwave Journal China.
EDI CON cannot pay travel or speaker expenses for any speakers presenting at the conference.
About the Technical Advisory Committee
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The EDI CON Technical Advisory Committee solicits papers for three types of sessions: technical papers, workshops and tutorials. There are currently openings for 48 technical papers to be presented in the technical sessions. Presentations must address one of the three conference tracks (High Frequency/High Speed Design, Device Measurement and Characterization, Systems). Technical papers should not exceed 3,000 words and a maximum of 6 figures, address design case studies, device characterization techniques (including measurements) and application overviews. These papers are presented during forty-minute sessions, each session featuring two theme related presentations allowing twenty minutes for each talk, including Q&A.
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The technical committee will consist of electronic design, test and application engineers and researchers from the RF/microwave and high speed digital design industries and academia, well-recognized for their technical leadership, experience and advanced expertise in the areas of EM, circuit and system simulation, test verification, RFIC, MMIC and RF/high-speed semiconductors, passive components, and system integration.
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The committee, through the guidance of the technical program advisors (MWJ editorial review board) and the Program Chairs, is responsible for the intellectual design and abstract solicitation for the conference. By working with industry-leading solution providers and their customers, the EDI CON organizers are focused on developing a horizontal show that attracts a broad range of high-valued visitors with direct interest in solutions for RF, Microwave and high-speed digital design.
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About the Organizers
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EDI CON is organized by Microwave Journal and Microwave Journal China, the event planning division of its parent company, Horizon House, and ACT International (Hong Kong), the publisher of Portable Design China and publishing partner of Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including European Microwave Week (EuMW) on behalf of the European Microwave Association (Eu
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A), and several major microwave related conferences/exhibitions such as the RF/Microwave, M2M and Mobile Backhaul Zones at CTIA. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed ICs, components, test and measurements, software, cables/connectors, systems and services.
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Management and Operations:
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Horizon House –
Ivar Bazzy, Jared Bazzy, Kristen Anderson - North America
Michel Zoghob - Europe
ACT International – Adonis Mak - China
Exhibition Sales:
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Microwave Journal – Carl Sheffres, Richard Vaughan
Microwave Journal China (ACT Intl.) – Adonis Mak
Technical Program Advisors:
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Microwave Journal - David Vye, Patrick Hindle, Richard Mumford.
Microwave Journal China - Katie Huang
Workshops/Tutorials:
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Agilent Technologies
Rohde & Schwarz
Anritsu
ANSYS
AWR/National Instruments
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