[讨论]什么仿真软件最好？

其实没有最好的软件，只有最适合做某块领域的软件，下面的一篇文章值得大家学习和了解！ j
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Who know the following software? Which is the best? mMmzi4HL  
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1. Advanced Electromagnetics u%?u`n2'  
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Albuquerque, New Mexico 8>a/x,  
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Phone: (505) 897-4741 Vt{C80n&N  
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Software: GEMACS R_J=x  
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Description: GEMACS stands for the "General Electromagnetic Model for the Analysis of Complex Systems." It consists of a suite of electromagnetic modeling tools for method of moments (MOM), uniform theory of diffraction (UTD), and finite differences (FD). These three techniques can be used individually or combined into 3D hybrids to work more complex problems. The GEMACS package also contains numerous support utilities and a graphics interface called XGAUGE (X-window Graphical Aid for the Users of GEmacs). With XGAUGE a user can build a geometry model with GEMACS modeling elements, as well as view surface current, near-field, and far-field results with color-coded contours. The principal GEMACS sponsor is the U.S Army Research Laboratory and the U. S. Air Force Seek Eagle Office. =1t#$JG  
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2. AnSoft Corporation {H s""/sb  
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Pittsburgh, PA D3Lu]=G  
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Phone: (412) 261-3200 l=*^FK]L`  
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Software: Maxwell 2D p#~
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Description: 2D electrostatic, magnetostatic, and low-frequency magnetic finite element analysis codes. *0M#{HQ  
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Software: Maxwell 3D B[7|]"L@  
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Description: 3D electrostatic, magnetostatic, and low-frequency magnetic finite element analysis codes. 
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Software: Ansoft HFSS +:1ay^YI  
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Description : 3D full-wave finite element code 2pFOC;tl  
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Software: Maxwell Eminence h-hU=I8  
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Description: electrostatic, magnetostatic and quasi-static field analysis and full-wave field simulation codes employing the finite element method and the boundary element method. K0 .f4o  
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Software: Microwave Explorer Kv"e\ E  
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Description: 3D planar moment method for MMIC and hybrid circuit design. fEc}c.!5  
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Software: Serenade ; iQ@wOL]  
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Description: This is an integrated software suite for all high frequency circuit and system designs such as RF and microwave. It is applicable for the following levels of analysis: circuit, system, electromagnetic simulation, and the physical design. quk~z};R>\  
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3. Applied Simulation Technology ;>[).fX>/  
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San Jose, CA lGqwB,K$z4  
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Phone: (408) 436-9070 (WiA  
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FAX: (408) 436-9078 FW&P`Iu  
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Software: ApsimRADIA =" K;3a`GI  
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Description: ApsimRADIA can simultaneously simulate radiated emission noise and conducted transmission line noise. It considers the impact of interconnect technology, cabling, packaging, and enclosure design on EMI. ApsimRADIA can predict both differential and common mode radiated emissions. Both types of EMI have a strong dependency on the physical design itself. Therefore accurate modeling tools to convert the physical entities into electrical properties are the key to successfully predicting the emitted radiation. ApsimRADIA uses a variety of field solvers to accomplish this. V[,/Hw~d%  
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Software: ApsimRADIA-WB vgOmcf%;  
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Description: ApsimRADIA-WB is designed to evaluate the impact of electrical and physical characteristics on EMI. ApsimRADIA-WB accurately predicts the radiated emissions from PCB, MCM, cables and subsystems. As a result, the user can investigate EMI issues from a system point of view as well. This avoids designs that work on a board basis but fail at the system level. ApsimRADIA-WB is a complete solution incorporating schematic capture, field solvers and EMI simulators in a fully integrated system. As the schematic is entered, the x,y,z coordinates of the physical interconnects are passed. Interconnect models can be simple impedance or delay lines or more complicated transmission lines as extracted from the field solver. The electrical models likewise, can be simple voltage or current sources, or more complicated behavioral IBIS or even Spice transistor level models. A 3D graphical playback display confirms the design. Once the design is entered, it is automatically simulated using ApsimRADIA and ApsimSPICE. The results can be viewed graphically or in a text, report, form and may be compared against an EMI standard of choice. Pass/fail assignments are then made. ApsimRADIA-WB provides insight into EMI issues resulting from physical placement, electrical specifications, interconnects and physical entities such as connectors. Design rules and conclusions leading to better designs can then be made at the earliest stage possible. The user can enter the physical interconnect locations and simulate their effects from a schematic diagram point of view. At the schematic level, changes to the electrical parts, physical entities and locations can easily be made without complicated CAD tools. Interactions of the physical locations of parts and electrical specifications of the interconnects can be studied for adverse effects. @eMDRbgq;[  
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4. Applied Wave Research, Inc. K1uN(T.Ju  
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Redondo Beach, CA 8h9t8?  
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Phone: (310) 370-2496 *JGm  
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FAX: (310) 793-6500 *2crhI*@>  
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Software: EMSight VBR@f<2L  
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Description: spectral-domain moment-method code for analyzing planar structures. L5%~H?K(  
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5. Bay Technology |s|
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Aptos, CA ;+K:^*oJ  
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Phone: (408) 688-8919 O;
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FAX: (408) 688-6435 vrn IEur  
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Software: IE3D F0:Fv;  
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Description: 3D Planar, Full Wave, Method of Moments Electromagnetic Simulation and Optimization software. Circuit parameters are extracted from the solved current distribution and saved in formats compatible with time and frequency domain circuit simulators. ]7zDdI|  
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Software: Fidelity * b>W  
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Description: FDTD Full 3D Electromagnetic Simulation Software. 5R4h9D5  
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6. EMS-Plus t)g1ICt  
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Durham, NC NFY,$  
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Software: EZ-EMC AM##:4   
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Description: 3D, FDTD technique; time or frequency domain results. Features: Shielding Analysis , Gasket performance Analysis , Cavity and Shielded Box Resonance , Heat-sink emissions analysis , Grounding Analysis , Susceptibility Analysis , Board Emissions , Ferrite Filter Analysis , Antenna Applications , Test Site Analysis (OATS, GTEM, Anechoic Room, etc.), etc. -Qo`UL.}  
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7. HyperLynx `Q1T-H_  
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Innoveda, Inc oe`oUnN  
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Marlborough, MA '1ff|c!x9  
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Phone: (800) 873-8439 !6|Kpy8  
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Software: HyperSuite EXT O(,Ezyx  
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Description: HyperSuite includes LineSim (Pre-Layout signal integrity simulation), BoardSim (Post-Layout signal integrity simulation), plus EMC and Crosstalk Analysis. With the HyperSuite, users can address high-speed PCB problems throughout the design cycle, beginning at the earliest, architectural stages and moving through post-layout verification. 7~cN  
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LineSim is a pre-layout signal integrity analysis tool. It provides the capability to investigate and plan for signal-integrity issues in the pre-routing design stages prior to PCB layout. Hypothetical interconnect scenarios may be entered in a “cell-based” schematic editor. Then, a detailed signal-integrity analysis may be performed. Waveforms are displayed in an oscilloscope viewer. The EMC analysis option to LineSim adds a spectrum analyzer that predicts radiated emissions from pre-layout net topologies. The predicted radiation levels can be compared at every frequency to government or user-defined limits. ~^" cNv  
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BoardSim is a post-layout signal-integrity analysis tool. It reads the information in an actual routed PCB layout and allows a designer to perform detailed signal integrity analysis based on the exact routing of a particular layout. For every net that is simulated, BoardSim automatically constructs an electromagnetic simulation model on a segment-by-segment and via-by-via basis. Analysis is available in both “batch” and interactive modes. BoardSim's EMC option is unique for post-layout verification in that it can predict radiation levels not only from PCB traces, but also from component packages. It does this without requiring any modeling information about the components' packages. )!3XM  
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8. Pacific ESI zF<*h~  
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Artarmon, Australia 3nd02:GF  
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Phone: (02) 9906-3377 sq*R)cZ  
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Software: PAM CEM 2000 0KnlomuH2  
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Description: This software was developed to perform realistic and predictive EMC simulations for industries such as aeronautics, telecommunications, electronics, and automotive. It is designed to simulate EMC lab testing, ranging from EMI caused by internal equipment wiring up to susceptibility or immunity of on-board equipment to external aggressions, as well as electromagnetic radiation of large harness systems towards the external environment (electromagnetic pollution). Capabilities include: Signal propagation on circuit boards and along interconnects: signal integrity, cross-talk, reflection and transmission analysis, s-parameter extraction; Electromagnetic compatibility and interference (EMC/EMI) analysis; Near to far field transform for radiation and EMC / EMI applications; Total field / scattered field zones for external wave sources; Electric, magnetic, and current density field sources; Built-in lumped elements including resistors, capacitors, inductors and voltage sources. $rs7D}VNc  
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9. Quantic EMC Inc. 4a>z]&s  
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Manitoba, Canada $q DH  
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Phone: (204) 942-4000 P^v`
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Software: the Quantic Engine - includes “Omega Plus” for signal integrity and EMC simulation, and “Compliance” for system level EMC simulation of PC boards, enclosures, and cables. =Z2U  
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Description: Use “Omega PLUS” for screening PCB layouts for crosstalk, ringing, time delays, overshoot, undershoot, settling time and noise margin violations. Locate high-emission regions and identify the nets that cause EMC violations. Simulate two-sided boards and multi-layer boards with split power and ground planes. “Compliance” allows an analysis of the effects upon radiated fields due to changes in single nets, groups of nets, entire printed circuit boards, and most importantly, complete systems combining boards, cabling and enclosures. This tool shows results relative to changes. It does not yield absolute field values for comparison to actual laboratory measurements. NeCTEe|V  
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10. Remcom Inc. %,a.431gi  
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State College, PA mn*.z!N=  
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Phone: (814) 353-2986 +F&w~UT  
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Fax: (814) 353-2986 {\`#,[  
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Software: XFDTD o?$D09j;;  
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Description: 3D full-wave Finite Difference Time Domain (FDTD) software allows users to decrease the cost and time required to bring new products to market by eliminating unnecessary generations of expensive physical prototypes. The simulation software provides for early evaluation in the design process without the need for actual fabrication. XFDTD is a full wave electromagnetic solver based on the Finite Difference Time Domain method. It is fully three- dimensional. CAD objects may be imported into XFDTD and combined and edited within XFDTD using the internal graphical editor. Plane wave excitation or voltage and current sources can be used to excite the structure. XFDTD has an extensive list of important features, including lumped loads, impedance, S parameters, near/far zone fields, antenna radiation and efficiency, SAR peak and averages, special materials, graphical display capabilities, and many others. Optional modules include multi-processor module, human body meshes, and 3D Solids and Layered CAD Importers. e.\d7_T+  
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11. SETH Corporation SWO$#X /  
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Johnstown, PA Da_g3z  
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Phone: (814) 255-4417 ..'^1IOA  
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Fax: (814) 255-3417 ?&)<h_R4p  
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Software: EMIT :
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Description: This software combines method of moments (MOM) and finite difference time domain (FDTD) methods. It uses 2D and 3D models and incorporates a user friendly graphical interface. The Toolbox approach offers three calculating kernel applications and two graphical processors with a variety of supporting Tools. SR%h=`t  
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12. Sigrity, Inc (J\"\#/d  
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Santa Clara, CA m$*dPje  
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Phone: (408) 260-9344 h<6@&yzp  
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Software: SPEED2000 j9) Z'L  
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Description: SPEED2000 integrates circuit and transmission line simulations with a fast, special-purpose electromagnetic field solver that computes electromagnetic interactions in multi-layer chip packages and printed circuit boards. In SPEED2000, power and ground planes are not treated as ideal power and ground planes with fixed potentials. Electromagnetic interactions inside packages (such as package resonance, coupling between different components, as well as interactions between circuits and packages) are taken into account during simulations. Transient as well as spatial variations of voltages and currents on power and ground planes are all computed and can be easily visualized. Signal waveforms computed by SPEED2000 automatically contain the effects of power and ground voltage bounces. SPEED2000 is a versatile electrical simulation tool for the analysis and design of electronic packages including chip carriers and printed circuit boards. It is particularly effective to be used for, but not limited to, following applications: Computation of power and ground noise; Evaluation and design of power and ground distribution systems, including power and ground plane arrangement, and power and ground via/pin assignment; Determination of decoupling capacitor placement, including the number, values, and locations of decoupling capacitors; Identification of package resonance; Evaluation of electromagnetic coupling between different components; Evaluation of signal and noise waveforms at various locations; Evaluation of signal and noise spectrum at various locations; Determination of frequency-dependent port parameters of packages, such as port input impedances, S parameters, and transfer functions between different ports; Evaluation of electromagnetic radiation from packages and printed circuit boards. _tb)F"4V  
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13. Simlab PCBMod (formerly Aramis) 0#G&8*FMN  
Distributed by Advanced EMC Solutions A 99 .
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Winnipeg, Manitoba, Canada 4B-v\3Ff  
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Phone: 204-957-5444 800-565-2787 syv6" 2Z'B  
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SimLab Software GmbH ]|Vm*zO  
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Munich, Germany fwf]1@#  
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Software: PCBMod 9W5vp:G  
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Description: PCBMod (formerly Aramis) - PCB analysis tool suite : includes field solvers, graphical viewers, analog model generator. Modules are StatMod, Static2D, Static 3D. Options include ATHOS – layout preprocessor, RadiaSim - EM radiation. CableMod - System connections. bxc#bl3  
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Simlab's software provides a frequency dependent analysis utilizing both the Partial Elements, Equivalent Circuit (PEEC) and Boundary Element Method (BEM) field solver as tools in the analysis of PCB's, cables, interconnects, and arbitrary structures ranging in sizes from large components to IC design. The PEEC method is used in the analysis of these structures and their parasitic inductance, skin effects, dielectric losses, and resonance values. DC analysis is usually not possi .. J ;i/X;^  
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但是似乎有点老。。。Simlab都木有了。。

呵呵，欢迎大家更新，加入更多的软件！

看得好辛苦呀大哥