[仿真]Simulation on Vertical Via Interconnection

Abstract-In the multi-chip module, signal o ABrhK  
transmission lines such as striplines or microstrip K*{RGE  
lines at different layers are connected through vias. It [f! { -T  
is very important to research the characteristics of via dP+wcl4  
because of the signal transmission discontinuity it S89j:KRXH%  
induced. In this paper, the matrix-penciled moment 9P)!v.,T/  
method is applied to analyze and compute the +3o0GJ  
scattering parameters of via in a multi-layered a!/\:4-uc  
module, and some important laws of scattering EI7n|X a1q  
characteristics of the via are obtained, and the dQZdL4  
corre .. M:/(~X{?  
Kw$@_~BJ6  

未注册仅能浏览部分内容，查看全部内容及附件请先 登录 或 注册

这是信号完整性问题吗？

謝謝分享唷!! 來學一下~~

谢谢呀，好人呀。

谢谢分享！

i want to learn this simulation for further knowing characteristic of via.

i want to learn this simulation for further knowing characteristic of via.

谢谢呀，好人呀。

dret       

学习！学习！！！！！！