[仿真]Numerical Simulation of Encapsulant Curing within a Variable Frequency

Abstract Curing of encapsulant material in a simplified microelectronics package using an open  ven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses =z'533C  
within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. RQ,X0
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Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric an .. u?KG%  
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好像是综合物理仿真

      

多谢分享。