[仿真]Numerical Simulation of Encapsulant Curing within a Variable Frequency

Abstract Curing of encapsulant material in a simplified microelectronics package using an open  ven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses ("_tML 8/p  
within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. ?Q/9aqHe;  
Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric an .. Q*caX   
wIK
&EGQ  

未注册仅能浏览部分内容，查看全部内容及附件请先 登录 或 注册

好像是综合物理仿真

      

多谢分享。