[案例]低损耗宽带混合堆叠电感双工器

In this letter, a miniaturized low-loss and wideband diplexer with mixed stacked inductors is proposed using the Dual-redistribution layer (dual-RDL) glass-based advanced packaging technology. The mixed using the 3-D stacked high-Q inductors and 2-D planar gradient inductors is introduced in the proposed diplexer for low insertion loss and compact chip size. Furthermore, a modified circuit topology is presented, which can generate multiple transmission zeros (TZs) outside of the two passbands. The proposed diplexer is realized using through glass via (TGV) technology and measuring with ground-source–ground (GSG) probe. From the measured results, it can achieve an insertion loss of less than 0.85 and 0.62 dB, and the isolation is better than 21.5 dB in the two operating bands (0.25–0.95 GHz and 1.71–2.69GHz). In particular, the proposed diplexer can achieve the wideband performance, and the measured fractional bandwidth (FBW) of the two passbands is 116.7% and 44.5%. Also, this design occupies an area of 1.6×0.8 mm. In comparison with the previously reported designs, the proposed diplexer shows the superior advantages of smaller size, wideband, and lower insertion loss. The simulation and measured results show good consistency.

该成果使用了法动科技射频EDA工具-UltraEM！[/backcolor ..

未注册仅能浏览部分内容，查看全部内容及附件请先 登录 或 注册

优秀资料+RF币

优秀资料+RF币

优秀资料+RF币

优秀资料

优秀资料+RF币

谢谢分享！

优秀资料+RF币