[资料]BGA封装技术(PDF下载)

[post]The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives forhigh I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problemsand minimized handling issues. During reflow the solder balls are self-centering (up to 50% off thepad), thus reducing placement problems during surface mount. Normally, because of the larger ballpitch (typically 1.27 mm) of a BGA over a QFP or PQFP, the overall package and board assemblyyields can be better. From a performance perspective, the thermal and electrical characteristics canbe better than that of conventional QFPs or PQFPs. The PBGA has an improved design-to-production cycle time and can also be used in few-chip-package (FCPs) and multi-chip modules (MCMs)configurations. BGAs are available in a variety of types, ranging from plastic overmolded BGAscalled PBGAs, to flex tape BGAs (TBGAs), high thermal metal top BGAs with low profiles (HLPBGAs), and high thermal BGAs (H-PBGAs).


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